3D AOI Systems


QE Fringe Pattern 3D Systems

TR7500 QE


The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection software ensures quick CAD-based programming and features fully customizable templates for zero escapes on any PCBA.

Main Features

  • Multi-angle 2D + 3D coverage
  • 4-Way Digital Fringe Projectors
  • 4 Side View Cameras
  • Up to 20mm 3D Height Range
  • High Speed CoaXPress Imaging

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TR7700QE


The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programming and features fully customizable templates for zero escapes on any PCBAs.


Main Features

  • Multi-angle 2D and 3D coverage
  • 4-Way Digital Fringe Projectors
  • Single Overhead Camera
  • Up to 20mm 3D Height Range
  • High Speed CoaXPress Imaging

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Laser-based 3D Systems


TR7500 SIII 3D


TRI's optimum 3D AOI solution offers robust 3D solder and component defect detection by way of multi-angle PCB inspection paired with blue-laser-based 3D profiling, delivering high inspection coverage. TRI's state-of-the art software solution with their third-generation intelligent hardware platform ensures easy programming and high accuracy.


Main Features

  •  High-speed colour multi-angle inspecton of up to 01005 components
  • High defect coverage using combined 2D and 3D inspection
  • True 3D profile measurement using dual laser units
  • Rapid programming interface with Auto-Library and Offline editing

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TR7700 SIII 3D


TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

Main Features

  • High Speed 2D + 3D Inspection of Up to 01005 Components
  • High Defect Coverage Using Hybrid 2D + 3D Inspection Technology
  • True 3D Profile Measurement Using Dual Laser Units
  • Rapid Programming Interface with Auto Library and Offline Editing

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