TR7500 SIII 3D

 TRI's optimum 3D AOI solution offers robust 3D solder and component defect detection by way of multi-angle PCB inspection paired with blue-laser-based 3D profiling, delivering high inspection coverage. TRI's state-of-the art software solution with their third-generation intelligent hardware platform ensures easy programming and high accuracy.

Main Features

  •  HIgh-speed colour multi-angle inspecton of up to 01005 components
  • High defect coverage using combined 2D and 3D inspection
  • True 3D profile measurement using dual laser units
  • Rapid programming interface with Auto-Library and Offline editing


Specifications

 • Top View Camera                       4 Mpix high speed color camera
 • 4 Angled View Cameras            1.3 or 6.5 Mpix (factory setting)
 • 3D Laser Sensor                        Dual 3D Laser sensors
 • Lighting                                      Multi-phase RGB+W LED
 • Optical Resolution*                  10 µm      15 µm
 • Laser Resolution*                     10 µm (Optional)     20 µm     50 µm
 • Imaging Method     Dynamic Imaging with True 3D Profile Measurement
 • 3D Inspection Range                 20 mm
 • Inspection Speed                       2D                                  2D+3D
                     15 µm               120 cm2/sec              40 - 60 cm2/sec**
                     10 µm               60 cm2/sec                27 - 39 cm2/sec**
*Factory setting
**depending on board size and laser resolution

 • Inspection Functions
    。Component                 Missing, Tombstoning, Billboarding, Polarity,                                                  Rotation, Shift, Wrong Marking (OCV),                                                            Defective, Upside Down, Lifted Component,                                                    Extra Component,Foreign Material
             
    。Solder Joint                Excess Solder, Insufficient Solder, Bridging,        
                                           Through-hole Pins, Lifted Lead, Golden                                                            Finger Scratch/Contamination

 • Pre & Post reflow integration   Yield Management System Integration                                                            (YMS4.0) and YMS Lite


 • Dimensions
      。PCB Size           
              TR7500 SIII 3D             50 x 50 – 510 x 460 mm
              TR7500L SIII 3D           50 X 50 - 660 X 460 mm
              TR7500 SIII 3D DL       50 x 50 – 510 x 250 mm x 2 lanes
                                                    50 x 50 – 510 x 550 mm x 1 lane
      。PCB Thickness                  0.6 – 5 mm
      。PCB Max Weight               3 kg

TR7700 SII PLUS

 The world's first hybrid 2D AOI - the TR7700 SII Plus can leverage both stop-and-go and dynamic imaging to achieve optimal inspection performance on all types of PCBAs (e.g. Inspection Cycle Time Reduction).


Main Features

  • A choice of Dynamic or Stop-and-Go imaging - just use software switch to select mode
  • Intelligent auto-conveyor system decreases load/unload time by up to 2.5 seconds
  • Accurate inspection and defect recognition with instant multi-phase lighting
  • Intelligent Easy Programming Interface

Specifications

• Camera Type                      4 Mpix high speed color camera 
• Lighting                              Multi-phase RGB+W LED
• Optical Resolution            8µm* or 10 µm or 15 µm (factory setting)
                                            
                                              *8µm is only in Dynamic Imaging
 
• Imaging Method                 Dynamic Imaging or Stop-and-Go
• Inspection speed         
        。Dynamic Imaging       15 µm 120 cm2/sec, 4.5 FOV/sec
        。Stop-and-Go               10 µm 60 cm2/sec,   4.5 FOV/sec


 • Inspection Functions
         。Component                Missing, Tombstoning, Billboarding,                                                                Polarity, Rotation, Shift, Wrong                                                                        Marking (OCV), Defective, Upside Down,                                                        Lifted Component, Extra Component

          。Solder Joint              Excess Solder, Insufficient Solder, Bridging,                                                    Through-hole Pins, Lifted Lead,                                                                        Golden Finger Scratch/Contamination
 
• Pre & Post reflow integration    Yield Management System Integration                                                             4.0 (YMS 4.0) and YMS Lite


 • Dimensions

Optical Resolution   
                      TR7700 SII PLUS                        TR7700 SII PLUS DL
               15 µm 10 µm            8 µm             15 µm 10 µm            8 µm